GLV technology employs Micro Electro Mechanical Systems (MEMS), which allow for microscopic structures to form on silicon chips. The structures are reflective and are constructed of several ribbon-like elements that can be moved up and down through the control of electrostatic forces. The motion of the ribbons covers only a small distance; equal to a fraction of the wavelength of light. The different ribbon elements are configured in a pattern that allows the structures to reflect and diffract light waves, which varies the level of light reflected from the surface of the silicon chip. In an analog system, the light is continuous, but the level of light is variable. In a digital system the light is pulsed (switched on and off). GLV is capable of handling extremely high laser power because its high reflective properties provide an efficient use of light.

Imaging optics for GLV based CTP systems provide a larger quantity of writing beams, which means that the imaging drum rotation speed can be reduced while still providing a greater degree of productivity. GLV technology is most often used in conjunction with several thermal (infrared) CTP systems.